THOUSAND OAKS, Calif. – February 14, 2018 – Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne DALSA, Inc., a global leader in imaging and vision solutions, successfully completed the qualification of a Wafer-Level-Packaged Vanadium Oxide (VOx) Microbolometer process for Long Wave Infrared (LWIR) imaging.
Microbolometers are Micro Electro Mechanical Systems or MEMS-based devices which detect infrared, or thermal, radiation and do not require cooling. Teledyne DALSA’s manufacturing process, located in its captive MEMS foundry in Bromont, Quebec, integrates proprietary low cost Wafer Level Packaging technology that bonds two 200 mm wafers precisely and under high vacuum, forming an extremely compact 3D stack. This technology eliminates the need for conventional chip packaging - which can account for 75% or more of the overall device cost.
“This is an important milestone in our journey to bring a credible price/performance VOx solution to market,” said Robert Mehrabian, Chairman, President and Chief Executive Officer of Teledyne. “With the qualification process complete we will now begin ramping up production lines for a 17-micron pixel 320×240 (QVGA) device, closely followed by a 17-micron 640×480 (VGA), with longer-term plans to introduce a highly compact 12-micron detector family. Among other applications, these new detectors will be offered as modules for OEMs and also integrated into Teledyne DALSA’s Calibir™ camera platform.”
For more information on Teledyne DALSA’s Wafer-Level-Packaged Vanadium Oxide (VOx) Microbolometer process or our Calibir infrared camera solutions contact Cees Draijer, Business Line Manager IR Products, email@example.com.
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. Teledyne DALSA employs approximately 1,400 employees worldwide and is headquartered in Waterloo, Canada. Teledyne DALSA is part of the Teledyne Imaging Group. For more information, visit www.teledynedalsa.com.
About Teledyne Technologies Incorporated
Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. Teledyne Technologies’ operations are primarily located in the United States, the United Kingdom, Canada, and Western and Northern Europe. For more information, visit Teledyne Technologies’ website at www.teledyne.com.
Forward-Looking Information Cautionary Notice
This press release contains forward-looking statements, as defined in the Private Securities Litigation Reform Act of 1995. Actual results could differ materially from these forward-looking statements. Many factors could change anticipated results, and risks are identified in Teledyne’s 2016 Annual Report on Form 10-K.
Investor Contact: Jason VanWees (805) 373-4542